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Acer Intel Core i5-3570T processor 2.3 GHz 6 MB L3
Acer Intel Core i5-3570T, Intel® Core™ i5, LGA 1155 (Socket H2), 22 nm, i5-3570T, 2.3 GHz, 64-bit
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Product Information
| Information | |
|---|---|
| Manufacturer | Acer |
| Product code | 228634239 |
| EAN | 04054317387350 |
| Manufacturer part number | KC.35701.TI5 |
| Category | Protsessorid |
| Processor | |
|---|---|
| Processor family | Intel® Core™ i5 |
| Processor cores | 4 |
| Processor socket | LGA 1155 (Socket H2) |
| Processor lithography | 22 nm |
| Box | N |
| Processor model | i5-3570T |
| Processor base frequency | 2.3 GHz |
| Processor operating modes | 64-bit |
| Processor generation | 3rd gen Intel® Core™ i5 |
| Processor threads | 4 |
| System bus rate | 5 GT/s |
| Processor boost frequency | 3.3 GHz |
| Processor cache | 6 MB |
| Processor cache type | L3 |
| L3 cache speed | 2.3 GHz |
| Thermal Design Power (TDP) | 45 W |
| Stepping | E1 |
| Bus type | DMI |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Processor code | SR0P1 |
| Maximum internal memory supported by processor | 32 GB |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Design | |
|---|---|
| Component for | PC |
| Features | |
|---|---|
| Compatible chipsets | Intel® B75 Express, Intel® H61 Express, Intel® H77 Express, Intel Q75 Express, Intel® Q77 Express, Intel® Z75 Express, Intel® Z77 Express |
| Market segment | Desktop |
| Memory | |
|---|---|
| Memory channels | Dual-channel |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1333,1600 MHz |
| ECC | N |
| Graphics | |
|---|---|
| On-board graphics adapter | Y |
| On-board graphics adapter model | Intel® HD Graphics 2500 |
| On-board graphics adapter base frequency | 650 MHz |
| On-board graphics adapter dynamic frequency (max) | 1150 MHz |
| Number of displays supported (on-board graphics) | 3 |
| Processor special features | |
|---|---|
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | Y |
| Supported instruction sets | AVX, SSE4.1, SSE4.2 |
| CPU configuration (max) | 1 |
| Graphics & IMC lithography | 22 nm |
| Intel® Anti-Theft Technology (Intel® AT) | Y |
| Intel® Identity Protection Technology (Intel® IPT) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Quick Sync Video Technology | Y |
| Intel® InTru™ 3D Technology | Y |
| Intel® Wireless Display (Intel® WiDi) | Y |
| Intel FDI Technology | Y |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Y |
| Intel® Insider™ | Y |
| Intel® Smart Cache | Y |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel® Secure Key | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Virtualization Technology for Directed I/O (VT-d) | Y |
| Conflict-Free processor | Y |
| Intel® vPro™ Platform Eligibility | Y |
| Processor package size | 37.5 mm |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Operational conditions | |
|---|---|
| Tcase | 69.8 °C |
Product Description
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.