For illustrative purpose only
DELL i5-760 processor 2.8 GHz 8 MB Smart Cache Box
DELL i5-760, Intel® Core™ i5, LGA 1156 (Socket H), 45 nm, i5-760, 2.8 GHz, 64-bit
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Product Information
| Information | |
|---|---|
| Manufacturer | DELL |
| Product code | 228632676 |
| Manufacturer part number | 1HGR8 |
| Category | Protsessorid |
| Processor | |
|---|---|
| Processor family | Intel® Core™ i5 |
| Processor cores | 4 |
| Processor socket | LGA 1156 (Socket H) |
| Processor lithography | 45 nm |
| Box | Y |
| Processor model | i5-760 |
| Processor base frequency | 2.8 GHz |
| Processor operating modes | 64-bit |
| Processor generation | Intel® Core™ i5 |
| Processor series | Intel Core i5-700 Desktop Series |
| Processor threads | 4 |
| System bus rate | 2.5 GT/s |
| Processor boost frequency | 3.33 GHz |
| Processor cache | 8 MB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 95 W |
| VID Voltage Range | 0.65 - 1.4 V |
| Stepping | B1 |
| FSB Parity | N |
| Bus type | DMI |
| CPU multiplier (bus/core ratio) | 21 |
| Memory bandwidth supported by processor (max) | 21 GB/s |
| Maximum internal memory supported by processor | 16 GB |
| Maximum number of PCI Express lanes | 16 |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Design | |
|---|---|
| Component for | PC |
| Features | |
|---|---|
| Compatible chipsets | Intel® H55 Express, Intel® H57 Express, Intel® Q57 Express |
| Market segment | Desktop |
| Number of Processing Die Transistors | 774 M |
| Processing Die size | 296 mm² |
| Number of Graphics & IMC Die Transistors | 774 M |
| Physical Address Extension (PAE) | 36 bit |
| Memory | |
|---|---|
| Memory channels | Dual-channel |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066,1333 MHz |
| ECC | N |
| Graphics | |
|---|---|
| On-board graphics adapter | N |
| Processor special features | |
|---|---|
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | N |
| Supported instruction sets | SSE4.2 |
| CPU configuration (max) | 1 |
| Embedded options available | N |
| Intel® Anti-Theft Technology (Intel® AT) | N |
| Intel® Hyper Threading Technology (Intel® HT Technology) | N |
| Intel® My WiFi Technology (Intel® MWT) | N |
| Intel® Turbo Boost Technology | Y |
| Intel® Quick Sync Video Technology | N |
| Intel® InTru™ 3D Technology | N |
| Intel® Wireless Display (Intel® WiDi) | N |
| Intel FDI Technology | N |
| Intel® Clear Video HD Technology (Intel® CVT HD) | N |
| Intel Dual Display Capable Technology | N |
| Intel® Insider™ | N |
| Intel Fast Memory Access | N |
| Intel Flex Memory Access | N |
| Intel® AES New Instructions (Intel® AES-NI) | N |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | N |
| Intel Enhanced Halt State | Y |
| Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | N |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel Demand Based Switching | N |
| Intel Rapid Storage Technology | N |
| Intel Clear Video Technology | N |
| Intel 64 | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Virtualization Technology for Directed I/O (VT-d) | N |
| Conflict-Free processor | N |
| Intel® vPro™ Platform Eligibility | N |
| Processor package size | 37.5 mm |
| Operational conditions | |
|---|---|
| Tcase | 72.7 °C |