For illustrative purpose only
Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
Gembird TG-G3.0-01, 4.5 W/m·K, Grey, 76 CPS, 0.205 °C/W, -50 - 240 °C, 120 mm
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Product Information
Product Description
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive