Iceberg Thermal FUZEIce heat sink compound Thermal paste 11.25 W/m·K 3.5 g - Case modding - PC Cases - IT equipment - MT Shop
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Iceberg Thermal FUZEIce heat sink compound Thermal paste 11.25 W/m·K 3.5 g

Manufacturer: Iceberg Thermal Product Code: 167602661 EAN: 01230000071697 MPN: BLACKICE4G-00A
Iceberg Thermal FUZEIce, Thermal paste, 11.25 W/m·K, 2.6 g/cm³, Green, 56000 poise, -50 - 200 °C
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Product Information


Information
Manufacturer Iceberg Thermal
Product code 167602661
EAN 01230000071697
Manufacturer part number BLACKICE4G-00A
Category Case modding

Product Description


Low Temperature with High Thermal Conductivity
Evenly spread layers of thermal paste with a high thermal conductivity of 11.25 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition

No Spatula? No Problem!
Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind.
Making it simple to apply with less mess.

Superior Operational Temperature
FUZEIce™ can handle up to 200°C and last for years!

There’s no paste like FUZEIce™
No Fuss, No Muss, No Problem

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