For illustrative purpose only
Qoltec 51644 heat sink compound 3.05 W/m·K 100 g
Qoltec 51644, 3.05 W/m·K, 0.073 °C/W, 100 g, 1 pc(s)
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Select | Supplier | Availability | Price | ETA |
---|---|---|---|---|
M2 | 2 | 24.83 € | ~ Th 03.04 | |
OV | 289 | 36.21 € | ~ We 09.04 |
Estimated delivery time of the product from selected supplier: ~ Th 03.04
24.83 €
tk
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Product Information
Information | |
---|---|
Manufacturer | Qoltec |
Product code | 03145077 |
EAN | 05901878516448 |
Manufacturer part number | 51644 |
Category | PC accessories |
Product Description
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.
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