For illustrative purpose only
Lenovo 4ZC7A08742 memory module 32 GB DDR4 2933 MHz ECC
Lenovo 4ZC7A08742, 32 GB, DDR4, 2933 MHz, 288-pin DIMM
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| Select | Supplier | Availability | Price | ETA |
|---|---|---|---|---|
| E1 | 0 | 169.90 € | ~ Tu 08.04 |
Estimated delivery time of the product from selected supplier: ~ Tu 08.04
169.90 €
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Product Information
| Information | |
|---|---|
| Manufacturer | Lenovo |
| Product code | 228594252 |
| EAN | 00889488505661 |
| Manufacturer part number | 4ZC7A08742 |
| Category | Mälumoodulid |
| Memory | |
|---|---|
| Internal memory | 32 GB |
| Internal memory type | DDR4 |
| Memory clock speed | 2933 MHz |
| Memory form factor | 288-pin DIMM |
| ECC | Y |
| Memory channels | Quad-channel |
| Design | |
|---|---|
| Component for | PC/Server |
| Features | |
|---|---|
| Buffered memory type | Registered (buffered) |
| Memory ranking | 2 |
| Harmonized System (HS) code | 84733020 |
Product Description
ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.
In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.
In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.
